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  • Stock Code :300410
    id02@zhengyee.com
    Pico Laser Cutting Machine JG32
    Product Name: Pico Laser Cutting Machine 
    Model Number: JG32
    Certification: CE
    Place of Origin: China
    Packaging Details: Wooden Carton
    • Usage
    • Features
    • Parameters
    • Video

    USAGE

     

    The machine is used in cutting for CVL/FPC/RF and thin multilayer board, as well as cutting a variety of substrates,such as ceramic, silicon, aluminium foil, teflon etc.



    Applications:

    Focus on flexible PCB,cover layer,golden finger,ceramic,crystal cutting and drilling.



    (1) Slight carbonization :

    Carbonization is much weaker compared with nanosecond laser processing.

     

    (2) Faster speed:

    Processing speed increased several times compared with nanosecond processing.

     

    (3)Cutting effect:

    The processing surface is more smooth, neat, clean;

     

    (4)More applications:

    In addition to the traditional circuit board polymer and copper foil processing, picosecond can also process ceramics, silicon,Teflon and other materials.

     

    (5)High intelligent :

    Support EMCS, MES system. Automatically choose the cutting graphics unit by using identification of 2D bar code .


    Specification of picosecond laser cutting machine

    Applied Range

    FPC,CVL,FPC, micro-connection, ceramics, silicon and so on

    System Processing Accuracy

    ( ZHENGYE Conditions)

    ±20μm

     Laser power

    15W@400kHz

     Laser Wavelength

    355nm

    Pulse Width

    10ps

    Frequency Range

    4kHz-1MHz

    Objects

    Large processing size

    550mmX650mm

    Table number

    Single beam, Dual platform

    Dimensions (L×W×H)

     2200mm×2150mm×1750mm

    Weight

    3700kg

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